EIA/JEDEC
STANDARD
EIA/JESD22-B102-C. SEPTEMBER 1998. ELECTRONIC INDUSTRIES ALLIANCE .... (Revision of Test Method B102-B). 3 Procedure for simulated board mounting reflow ...
http://www.spsemi.co.kr/plan/JESD22-B102.pdf
QPCN09007_ Power TR Subcontractor change Notification
13 Jul 2009 ... JESD22-A102. 1. 77. 0. PASS. Solderability. JESD22-B102. 1. 77. 0. PASS. Effect Part Number list: Please refer to appendix excel file.
http://www.setron.de/_downloads/pcn/tsc/QPCN09007_PowerTRSubcontractorchangeNotification.pdf
Module
Report
JESD22-B107. 20. 0. MARK PERMANENCY. DYS. 0136. 1. JESD22-B102 ... JESD22-B100. 6. 0. PHYSICAL DIMENSIONS. DYS. 0137. 1. JESD22-B102 ...
http://www.maxim-ic.com/reliability/dallas/DS1286.pdf
Module
Report
X-RAY FLUORESCENCE 0713. JESD22-B102, COND C (215C). 6. 0. SOLDERABILITY (Sn/Pb) 0713. JESD22-B102, COND C (245C). 6. 0. SOLDERABILITY (Pb- ...
http://www.maxim-ic.com/reliability/product/DS12C887.pdf
PRODUCT SPECIFICATION
JESD22-B102-C. 230°C max. 2 Times. OK. 3. Reflow Test. JESD22-B102-C. 230°C max. 2 Times. OK. 4. Thermal Shock. JESD22-A106-A. -40°C ~ 85°C ...
http://www.elv-downloads.de/service/manuals_hw/75120_PLCC2_LED_Data.pdf
Lead-free
Component and Assembly Qualification Process
JESD22-B102-D SOLDERABILITY TEST METHOD. (waiting for Pb-free update). • J-STD-002B SOLDERABILITY TEST FOR. COMPONENT LEADS, TERMINATIONS, LUGS, ...
http://www.smta.org/files/capital_vendor_show_presentation1.pdf
Microsoft PowerPoint - RQR-105585 (C draft) SGA SGC SOT89
Steam Age Condition C. Dip Condition A, 215°C. JESD22-B102. (Z version). Dip & Look. Steam Age Condition C. Dip Condition B, 245°C. JESD22-B102. (Z version) ...
http://www.rfmd.com/CS/Documents/RQR-105585_(C)_SGA_SGC_SOT89.pdf
Microsoft PowerPoint - RQR-105758 (B) SXE-1089Z
Steam Age Condition C. Dip Condition A, 215°C. JESD22-B102. Dip & Look. Sn/Ag/Cu solder. Steam Age Condition C. Dip Condition B, 245°C. JESD22-B102 ...
http://www.rfmd.com/CS/Documents/CXE-1089Z_Qualification_Report.pdf
Product Qual Requirements
JESD22- B102. Precondition C. Solderability cond B. 15/0,. 5 leads per device. 2 lots. Mark Permanancy JESD22- B107. 12/0. 2 lots. Flammability ...
http://www.silicon-ops.com/downloads/ProductQualificationGuidelines.pdf
Module
Report
JESD22-B100. 6. 0. PHYSICAL DIMENSIONS. DYS. 0317. 5. JESD22-B102 ... JESD22-B102. 3. 0. SOLDERABILITY. DYS. 0404. 5. JESD22-B100. 6. 0. PHYSICAL DIMENSIONS ...
http://korea.maxim-ic.com/reliability/product/DS1742.pdf
ASAT
EDQUAD Plastic Quad Flatpack Package Reliability Assessment ...
JEDEC standard JESD22-B102. 25 leads on each sample device were tested. The results are shown in Table 5. Table 5 - Solderability Results ...
http://www.triquint.com/shared/pubs/packages/97-05-edquad.pdf
Cirrus Logic Process Change Notification
93 °C steam aging. JESD22-B102. Solderability. 1. 0/15. QJ1429. 8 Hours. 245 °C solder bath. 5 Seconds. HTSL (high-temp storage life). 150 °C. JESD22-A103 ...
http://www.digikey.com/Web Export/Supplier Content/Cirrus_598/PDF/Cirrus_PCN_CS510x_CS532x_ANST.pdf
Cirrus Logic Process Change Notification
JESD22-B102. Solderability. 1. 0/15. QJ1502 (G700-Similarity). 8 Hours. 245 °C solder bath. 5 Seconds. HTSL (High Temp Storage Life). 150 °C. JESD22-A103 ...
http://www.digikey.com/Web Export/Supplier Content/Cirrus_598/PDF/Cirrus_PCN_CS5550.pdf
SILICON CERT
LABORATORIES
21 Sep 2009 ... JESD22-B102, Methods 1 and 2. JSTD-002. AEC-Q100, AEC-Q101, AEC-Q200. MIL-STD-883, Method 2003. MIL-STD-750, Method 2026. Mechanical Shock ...
http://www.siliconcert.com/17025.pdf
Description of Part No
JESD22-B102-B. And CNS-5068. Accelerated aging 155°C/ 24hrs. Tinning speed: 2.5+0.5cm/s. Tinning: A: 215°C/ 3+1s or B: 260°C/ 10+1s. Resistance to ...
http://www.msc-ge.pl/download/opt/datasheets/HT-F195Seriesv1.4.pdf
AEC Pb-free Requirements - Proposal 8-15-07
specification (e.g., J-STD-002 Test A, JESD22-B102 Method 1, etc.). Dip and Look testing shall include use of both SnPb and Pb-free solder alloys and ...
http://www.ec-central.org/engineering/Committees/U1/AEC Pb-free Requirements - Final Proposal 8-15-07.pdf
Minutes of the Joint ECA Soldering Technology Committee (STC
...
The team reviewed details of EIA/JESD22-B102-D which is dated January 2004. This document is the updated version of B102 which now includes lead-free ...
http://www.ec-central.org/engineering/committees/STC/STC minutes_Apr 20 04-DRAFT.pdf
QU A LIT Y & R E LIA B ILIT Y
JESD22-B108. 0.10 mm (0.004 in.) Physical Dimensions. Opto-Mechanical. Specific Package Outline Drawing. Solderability. JESD22-B102-A. 8 Hour Steam Age ...
http://www.hittite.com/content/documents/commercial_standard_product_qual_monitoring_program.pdf
TQ-5M31 Reliability Monitor Testing PDF
The test shall be performed according to JESD22-B102. Purpose: The purpose of this test is to provide a means of determining the solderability of devices ...
https://www.tqs.com/shared/pubs/monitors/00-03-5M31_Monitor.pdf
PKF series
JESD22-B102. Operational life test. Temperature. Maximum load. Input voltage on. Input voltage off. Duration. 85°C. 9min. 3min. 1000hrs. Moisture reflow ...
http://rfelektronik.se/manuals/Datasheets/PKF4000series.pdf
Akkreditiere
JESD22-A121. Test for Measuring Whisker Growth on "Tin and Tin Alloy. Finishes". Surface. JESD22-B102. Solderability. MlL-STD-883 method 1004 ...
http://www.roodmicrotec.com/fileadmin/user_upload/pdfs_Broschuere_Praesentation/pdfs_Qualitaet/17025-Certificate_Noerdlingen_e.pdf
Quality and
Reliability for Interface and Logic
JESD22-B107. Flammability. UL94V-0. Certificate. Solderability. JESD22-B102. 245C, 5 sec. Bond Pull. JESD22-C100. Bond Shear. AEC-Q100-001. Die Shear ...
http://www.fairchildsemi.com/ms/MS/MS-509.pdf
Date
Created : 2009/03/26 Date Issued On : 2009/04/08 PCN ...
Test: (Solderability) | Conditions: | Standard: JESD22-B102. Lot. Device. Results. Failure Code. Q20080001AASOLDCA. RA9117. 0/11. Q20080001AASOLDCB ...
http://www.fairchildsemi.com/pcn/PCN/2009/Q1091302.pdf
Assembly Report2
JESD22-B102, COND C. 15. 0. SOLDERABILITY (Pb-Free). 0. Total: OPERATING LIFE. DESCRIPTION. READPOINT. CONDITION. QTY FAILS. FA#. 1000. 125C, 5.25 VOLTS ...
http://www.hksunsun.com:8050/Information/Document/max/maxim/pdf/reliability/dallas/OSEP_6TSOC_LF.pdf
ATP, 28 TSSOP, Sumitomo G700K Dallas Semiconductor
JESD22-B102. 15. 0. JESD22-B107. 15. 0. PLATING THICKNESS. 0345. CO-PLANARITY .... JESD22-B105 TEST CONDITION B. 6. 0. SOLDERABILITY. 0349. JESD22-B102 ...
http://www.hksunsun.com:8050/Information/Document/max/maxim/pdf/reliability/dallas/ATP_28TSSOP.pdf
Reliability
Qualification Report
JESD22-B102-C. PASS. PASS. TEST DURATION. 2005/9/30~2005/12/20. TEST CONCLUSION. PASS. COMMENT. Take yield for experiment directly, there is no data before ...
http://www.haohong-ic.com/hh/webadmin/uploadfile/rqr2.pdf
JEDEC
STANDARDS
JESD22-B102 - SOLDERABILITY TESTING. This document defines a standard test method for determining the solderability of device package terminations that ...
http://www.antistaticbags.it/JEDEC STANDARDS.pdf
Automotive Electronics Council-Q200 Stress Test Qualification for
...
JESD22-B102(2). 15 each condition. 0 a) Method B, 4hrs @155ºC dry heat @ 235ºC b) Method B @ 215ºC cat 3 c) Method D cat 3 @ 260ºC ...
http://www.syfer.apls.ru/assets/files/an0009_aec-q200_qualification_for_passive_components.pdf
QR-HEMT-SOT363-A
Reliability & Qualification Report
JESD22-B102 . 260°C . Dwell Time: 5 sec. 30. 0. Moisture/Reflow. Sensitivity. J-STD-020D . Soak: 192 hrs @ 30°C & 60% RH . 3 times IR reflow @ 260°C ...
http://www.asb.co.kr/QA/QR/QR-HEMT-SOT363-A.pdf
APPROVAL
SHEET
JESD22-B102-C. 230C max. 2 Times. 60. OK. 3. Reflow Test. JESD22-B102-C. 230C max. 2 Times. 20. OK. 4. Thermal Shock. JESD22-A106-A. -40C ~ 85C. 84 Cycles ...
http://www.aot.cn/images/AOT-6060HPW-0303BD-H (ver1).pdf
APPROVAL
SHEET
JESD22-B102-C. 240C max. 2 Times. 60. OK. 5. Reflow Test. JESD22-B102-C. 240C max. 2 Times. 20. OK. 6. Thermal Shock. JESD22-A106-A. -40C ~ 85C. 84 Cycles ...
http://www.aot.cn/images/AOT-4008S-B112-Z-H (20mA) (ver2).pdf
David Fitton Quality Engineer
JESD22-B102. 6. 398. 0. 398. 0.000. Solderability (Post Hot Store). IEC68-2-20. 1. 45. 0. 45. 0.000. Electrical Stress Trials. Electrical Trial Type: ...
http://diodes.com/zetex/_pdfs/3.0/reliability/RTSMOSFET_SOT23.pdf
Benchmarldng reliability tests for plastic laminate modules - GaAs
...
JESD22-B102. 9. Moisture Sensitivity. IPC/JESD J-STD-020. 10. ESD Sensitivity. JESD22-A114&C101. A product was selected as an example for qualification. ...
http://ieeexplore.ieee.org/iel5/8359/26340/01167867.pdf?arnumber=1167867
GAN-ON-SI
RELIABILITY: A COMPARATIVE STUDY BETWEEN PROCESS PLATFORMS.
by S Singhal - Cited by 2
http://www.nitronex.com/pdfs/SINGHAL_ROCS2006_final paper.pdf
NPT35050A Qualification Document
Solderability tested per JESD22-B102 at 245°C using mechanical samples. Sample Size: 4 devices per lot. Page 12. DOC ID: NGD-007. REVISION: ...
http://www.nitronex.com/pdfs/NPT35050 Product Qual - Rev 2 - FINAL-1.pdf
July 1,
2001
6.1.1 Section 1.4 of J-STD-002 and Section 4.1 of JESD22-B102 – Aging Preconditioning. Steam age preconditioning is performed before the solderability test ...
http://www.koaspeer.com/pdfs/KSE_PbFreeStatement.pdf
GENERAL INFORMATION
JEDEC Standard JESD22-B102, Solderability (of commercial solid-state devices). JEDEC Publication JEP113, Symbol and Label for. Moisture-Sensitive Devices ...
http://www.allegromicro.com/en/products/Design/pub26011.pdf
MSE1PB thru
MSE1PJ Surface Mount ESD Capability Rectifiers
16 Jun 2009 ... J-STD-002 and JESD 22-B102. M3 suffix meets JESD 201 class 1A whisker test, HM3 suffix meets JESD 201 class 2 whisker test ...
http://www.radiant.su/files/images/Vishay/mse1pj.pdf
APPROVAL
SHEET
2 Soldering Test JESD22-B102-C. 260C max. 2 Times. 20. OK. 3. Reflow Test JESD22-B102-C. 260C max. 2 Times. 20. OK. 4 Thermal Shock JESD22-A106-A ...
http://www.priorled.com/images/download0120.pdf
SPECIFICATION 0001 Page 1 of 4 ISSUE 12.2 UPDATE NOTICE 2 19
...
TC5 Solderability test number of lots reduced from. 3 to 1 and test ref. changed to JESD22-B102. TC4 Marking permanency reference changed to. JESD22-B107. ...
http://www.stackinternational.com/public/specs/iss_1222/122_n2.pdf
32 TSOP 8mm Dallas Semiconductor
Date Code Range: Theta JA: Theta JC: PACKAGE TESTS. DESCRIPTION. READPOINT. CONDITION. QTY FAILS. DATE CODE. FA#. JESD22-B102 ...
http://www.datasheetcatalog.org/datasheets/37/282080_DS.pdf
A1140/42/43/45
3 per model per V step. JESD22-A114 & A115,CDF-. AEC-Q100-002, 003 & 011. Solderability (SD). 1. 15. JESD22-B102. Early Life Failure Rate ...
http://www.datasheetcatalog.org/datasheet/allegromicrosystems/1140.pdf
ALDER – RGB Power Module
Soldering Test JESD22-B102-C. 230C max. 2 Times. 60. OK. 3. Reflow Test. JESD22-B102-C. 230C max. 2 Times. 20. OK. 4. Thermal Shock JESD22-A106-A. -40C 85C ...
http://www.alder-newled.eu/cms/upload/bilder-alder/ledmodule/Alder_-_RGB_Power_Module.pdf
ALDER – RGB Power Module
2 Soldering Test JESD22-B102-C. 230C max. 2 Times. 60. OK. 3. Reflow Test JESD22-B102-C. 230C max. 2 Times. 20. OK. 4 Thermal Shock JESD22-A106-A ...
http://www.alder-newled.de/cms/upload/bilder-alder/ledmodule/Alder_-_RGB_Power_Module.pdf
HSMW-C130 RDS
14Sept06.pmd
Solderability. JESD22-B102. 8 hours aging and solder dip at. 245°C for 5 seconds. 10. 0. Low Temperature Storage. JESD22-A103. -40°C. 1000hrs ...
http://www.farnell.com/datasheets/87294.pdf
SE10PB thru
SE10PJ Surface Mount ESD Capability Rectifiers
J-STD-002 and JESD22-B102. E3 suffix for consumer grade, meets JESD 201 class. 1A whisker test. Polarity: Color band denotes the cathode end ...
http://www.farnell.com/datasheets/39618.pdf
SILICON CERT
LABORATORIES
JESD22-B102, Methods 1 and 2. JSTD-002. AEC-Q100, AEC-Q101, AEC-Q200. MIL-STD-883, Method 2003. MIL-STD-750, Method 2026. Mechanical Shock. JESD22-B104 ...
http://www.a2la.org/scopepdf/2930-01.pdf
US79
Series
MIL 883 Method 2003 / EIA/JEDEC JESD22-B102. Solderability. For all soldering technologies deviating from above mentioned standard conditions (regarding ...
http://www.yeint.ru/suppliers/melexis/pdf/US79_rev006.pdf
MLX90254
MIL 883 Method 2003 / EIA/JEDEC JESD22-B102. Solderability. For all soldering technologies deviating from above mentioned standard conditions (regarding ...
http://www.yeint.ru/suppliers/melexis/pdf/MLX90254_rev005.pdf
MLX90217
s MIL 883 Method 2003 / EIA/JEDEC JESD22-B102. Solderability. For all soldering technologies deviating from above mentioned standard conditions ...
http://www.parallax.com/dl/docs/prod/compshop/MLX90217.pdf
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